XL25D-TO220-18.5-12-1
t-Global Technology
XL25D-TO220-18.5-12-1
t-Global Technology
CERAMIC HEAT SPREADER 20X18.5X1M
Reference Price (USD)
1+
$2.48000
500+
$2.4552
1000+
$2.4304
1500+
$2.4056
2000+
$2.3808
2500+
$2.356
Exquisite packaging
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XL25D-TO220-18.5-12-1
$2.48
Product details
t-Global Technology's XL25D-TO220-18.5-12-1 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.Optimized for LGA 4677 sockets, the solution manages {Power Dissipation @ Temperature Rise} at server inlet temperatures up to 45 C. The thermal interface maintains performance through 50,000 insertion cycles.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 0.787" (20.00mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 0.728" (18.50mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.Precision 0.039" (1.00mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.
Product Attributes
- Product Status: Active
- Type: Heat Spreader
- Package Cooled: TO-220
- Attachment Method: -
- Shape: Rectangular
- Length: 0.787" (20.00mm)
- Width: 0.728" (18.50mm)
- Diameter: -
- Fin Height: 0.039" (1.00mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Ceramic
- Material Finish: -
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