XPDNC200S-01
Lantronix, Inc.
XPDNC200S-01
Lantronix, Inc.
IC MOD DSTNI-EX 25MHZ 256KB
Reference Price (USD)
1+
$75.55000
500+
$74.7945
1000+
$74.039
1500+
$73.2835
2000+
$72.528
2500+
$71.7725
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Product details
Engineered for next-generation automotive electronics, the XPDNC200S-01 by Lantronix, Inc. redefines performance in the Embedded - Microcontroller, Microprocessor, FPGA Modules category. Its combination of functional safety features and high-speed processing makes it ideal for ADAS and autonomous vehicle perception systems.The MPU Core architecture provides automotive-grade reliability with its dual-core lockstep configuration. This fail-operational design exceeds ISO 26262 ASIL-D requirements for safety-critical vehicle systems.The DSTni-EX delivers automotive-qualified performance with its temperature-compensated clock generation. Its superscalar architecture efficiently processes multiple sensor fusion algorithms simultaneously for comprehensive environment modeling.With the XPort Direct+ handling dedicated neural network acceleration, the module achieves unprecedented object detection speeds. This hardware acceleration is crucial for meeting the low-latency demands of autonomous emergency braking systems.Operating at 25MHz, the processor meets the real-time requirements of vehicle bus networks. The clock distribution network features automotive-grade jitter attenuation for reliable CAN FD and Automotive Ethernet communication.The 512KB flash memory supports over-the-air update capabilities with robust rollback protection. This secure storage solution is essential for complying with automotive cybersecurity standards like WP.29.256KB of error-correcting RAM ensures fault-tolerant operation of safety monitors. The memory subsystem's parity checking provides additional protection against single-event upsets in radiation-prone environments.The automotive-grade RJ45 interface meets USCAR vibration specifications. Its sealed design prevents moisture ingress in under-hood applications while maintaining signal integrity at high speeds.With dimensions of 1.25" x 1.7" (31.8mm x 43.3mm), the module fits within stringent automotive form factor requirements. The package's thermal design maintains performance during extended high-temperature operation in engine compartments.Qualified for -40°C ~ 85°C, the solution withstands the thermal extremes of electric vehicle power electronics. Extensive reliability testing ensures operation throughout the vehicle's lifespan.
Product Attributes
- Product Status: Not For New Designs
- Module/Board Type: MPU Core
- Core Processor: DSTni-EX
- Co-Processor: XPort Direct+
- Speed: 25MHz
- Flash Size: 512KB
- RAM Size: 256KB
- Connector Type: RJ45
- Size / Dimension: 1.25" x 1.7" (31.8mm x 43.3mm)
- Operating Temperature: -40°C ~ 85°C