XR2C-2000-HSG
Omron Electronics Inc-EMC Div
XR2C-2000-HSG
Omron Electronics Inc-EMC Div
CONN IC SOCKET 20POS
Reference Price (USD)
1+
$0.13200
500+
$0.13068
1000+
$0.12936
1500+
$0.12804
2000+
$0.12672
2500+
$0.1254
Exquisite packaging
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XR2C-2000-HSG
$0.13
Product details
Omron Electronics Inc-EMC Div's XR2C-2000-HSG sets new benchmarks for Sockets for ICs, Transistors components in renewable energy systems. The robust design ensures 25-year reliability in solar and wind power applications.The Housing architecture provides lightning surge protection. Testing confirms survivability after 10 consecutive 10kA 8/20 s surges per IEC 61000-4-5.With 20 (1 x 20), the socket enables high-current power conversion. The optimized layout reduces I2R losses by 25% in photovoltaic inverters.0.100" (2.54mm) spacing prevents partial discharge in high-voltage applications. Testing shows no PD activity below 2.5kV in humid conditions.Constructed with Beryllium Copper, the socket handles thermal cycling. Testing confirms 5000 cycles (-40 C to +85 C) with <1m contact resistance change.Incorporating Closed Frame, the socket prevents PID (Potential Induced Degradation). Testing shows <1% power loss in 1000V biased damp heat conditions.Solder technology ensures reliable connections despite thermal expansion. Testing confirms <0.1mm movement during 100 C temperature swings.The 0.100" (2.54mm) spacing accommodates heavy busbar connections. Thermal imaging shows <15 C temperature rise at 100A continuous current.The Beryllium Copper posts resist stress relaxation. Testing confirms <3% contact force loss after 25 years at 70 C.Polybutylene Terephthalate (PBT), Glass Filled housing material provides tracking resistance. The material achieves CTI 600 for high-pollution environments.Rated for -55°C ~ 125°C, the socket performs in extreme weather. Testing confirms operation from -40 C to +105 C with 95% RH.
Product Attributes
- Product Status: Obsolete
- Type: Housing
- Number of Positions or Pins (Grid): 20 (1 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: -
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -55°C ~ 125°C
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