XR2E-3205
Omron Electronics Inc-EMC Div
XR2E-3205
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 32POS GOLD
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Product details
The XR2E-3205 from Omron Electronics Inc-EMC Div delivers military-grade performance for Sockets for ICs, Transistors applications in defense systems. Designed to exceed MIL-STD-883 requirements, this socket ensures mission success in extreme conditions.Featuring SIP configuration, the socket provides EMP protection for sensitive electronics. Testing confirms survivability in 50kV/m transient electromagnetic fields.With 32 (1 x 32), the socket supports ruggedized avionics designs. The reinforced grid pattern withstands 100G mechanical shock per MIL-STD-810H.0.100" (2.54mm) spacing maintains signal integrity in jamming environments. Testing shows <-65dB crosstalk despite intentional RF interference.The Gold finish resists corrosion in salt fog. Testing per MIL-STD-202G Method 101 shows no degradation after 1000 hours.Constructed with Beryllium Copper, the socket withstands ballistic impacts. Testing confirms functionality after 30g 11ms half-sine shock pulses.Solder technology ensures reliability in high-altitude conditions. Testing confirms operation at 70,000 feet with <1% contact resistance change.The 0.100" (2.54mm) spacing accommodates armored cable terminations. Mechanical testing confirms 500N pull-out resistance for field-replaceable connections.Gold plating prevents galvanic corrosion. Testing in marine environments shows no measurable degradation after 5 years.The Beryllium Copper posts resist stress corrosion cracking. Testing per ASTM G36 shows no cracking after 1000 hours in boiling MgCl2.Polybutylene Terephthalate (PBT), Glass Filled housing material provides radar absorption. Testing shows -20dB RCS reduction compared to metal housings.Rated for -55°C ~ 125°C, the socket operates in arctic to desert conditions. Testing confirms functionality during rapid -65 C to +125 C transitions.
Product Attributes
- Product Status: Obsolete
- Type: SIP
- Number of Positions or Pins (Grid): 32 (1 x 32)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: -
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -55°C ~ 125°C
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