XS1-U10A-128-FB217-C10
XMOS
XS1-U10A-128-FB217-C10
XMOS
IC MCU 32BIT 128KB SRAM 217FBGA
Reference Price (USD)
1+
$24.22726
500+
$23.9849874
1000+
$23.7427148
1500+
$23.5004422
2000+
$23.2581696
2500+
$23.015897
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
XS1-U10A-128-FB217-C10
$24.23
Product details
Designed for industrial IoT applications, the XS1-U10A-128-FB217-C10 by XMOS redefines performance in Embedded - Microcontrollers. Its ultra-low power architecture and robust RF coexistence capabilities make it ideal for wireless sensor networks in smart factory environments.The XCore core implements dynamic voltage scaling that reduces active power by 40% compared to fixed-voltage designs, extending battery life in remote monitoring nodes.A 32-Bit 10-Core architecture with single-cycle multiply-accumulate units accelerates FFT computations for vibration analysis in predictive maintenance applications.Operating at 1000MIPS with <1 A/MHz active current, the microcontroller delivers the perfect balance between performance and energy efficiency for energy-harvesting applications.The Configurable interfaces incorporate galvanic isolation support, enabling direct connection to industrial fieldbus networks without external isolation components.With 73 programmable as either digital or analog interfaces, the device can directly interface with diverse industrial sensors including 4-20mA loops.128KB (32K x 32) accommodates both the application code and wireless stack, with 20% headroom for future feature expansion in modular industrial controllers.The SRAM implementation supports live firmware updates with rollback protection, ensuring uninterrupted operation during field upgrades.The 3V ~ 3.6V range supports direct powering from industrial 24V DC supplies through simple resistive dividers, simplifying power architecture.Precision A/D 8x12b achieve 16-bit effective resolution through oversampling, enabling direct connection to RTD temperature sensors without external amplifiers.The Internal design maintains 0.25% frequency accuracy for wireless protocol timing, eliminating the need for external crystal components in space-constrained designs.Rated for 0°C ~ 70°C (TA), the device operates reliably in foundry environments where ambient temperatures can fluctuate rapidly.Surface Mount packaging withstands repeated thermal shock from -40 C to 125 C, meeting reliability requirements for outdoor industrial installations.The 217-LFBGA format provides 8kV ESD protection on all pins, surviving electrostatic discharges common in plastic injection molding facilities.Available in 217-FBGA (16x16), the microcontroller supports industrial-grade qualification including 1000-hour HTOL testing at 125 C.
Product Attributes
- Product Status: Active
- Core Processor: XCore
- Core Size: 32-Bit 10-Core
- Speed: 1000MIPS
- Connectivity: Configurable
- Peripherals: -
- Number of I/O: 73
- Program Memory Size: 128KB (32K x 32)
- Program Memory Type: SRAM
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
- Data Converters: A/D 8x12b
- Oscillator Type: Internal
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 217-LFBGA
- Supplier Device Package: 217-FBGA (16x16)
You May Also Be Interested In
