XS1-U12A-128-FB217-I10
XMOS
XS1-U12A-128-FB217-I10
XMOS
IC MCU 32BIT 128KB SRAM 217FBGA
Reference Price (USD)
1+
$34.61036
500+
$34.2642564
1000+
$33.9181528
1500+
$33.5720492
2000+
$33.2259456
2500+
$32.879842
Exquisite packaging
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XS1-U12A-128-FB217-I10
$34.61
Product details
XMOS's XS1-U12A-128-FB217-I10 delivers military-grade reliability in Embedded - Microcontrollers, developed for aerospace and defense applications where radiation tolerance and mission longevity are paramount.The XCore core incorporates triple modular redundancy for SEU mitigation, achieving >99% single-event upset immunity in orbital radiation environments.A 32-Bit 12-Core architecture with parity-protected data paths prevents silent data corruption, meeting MIL-STD-883G requirements for spaceborne electronics.When operating at 1000MIPS, the microcontroller maintains timing accuracy within 0.01% despite temperature variations from -55 C to 125 C, critical for navigation systems.The Configurable interfaces implement Manchester encoding for noise-immune data transmission, ensuring reliable communication in high-EMI environments like radar installations.With 73 MIL-STD-1553-compatible interfaces, the device can serve as a remote terminal in distributed avionics architectures without external transceivers.128KB (32K x 32) of TMR-protected storage accommodates flight control algorithms with full error detection and correction capabilities.The SRAM implementation uses SONOS technology that withstands 300krad total ionizing dose, exceeding space qualification requirements.The 3V ~ 3.6V range supports operation from unregulated spacecraft power buses with 100mV ripple, eliminating need for additional regulation stages.Precision A/D 8x12b maintain 12-bit accuracy during solar flare events, providing reliable telemetry data even during peak radiation periods.The Internal clock source incorporates automatic frequency compensation that maintains <1ppm/ C drift across the military temperature range.Qualified for -40°C ~ 85°C (TA), the device operates reliably in exoatmospheric conditions where thermal cycling extremes exceed commercial specifications.Surface Mount packaging uses AuSn die attach for superior thermal conductivity in vacuum environments, preventing die delamination during thermal transients.The 217-LFBGA format provides hermetic sealing against moisture ingress, meeting MIL-PRF-38534 Class K requirements for high-reliability applications.Available in 217-FBGA (16x16), the microcontroller undergoes rigorous screening including burn-in and 100% electrical testing at temperature extremes.
Product Attributes
- Product Status: Active
- Core Processor: XCore
- Core Size: 32-Bit 12-Core
- Speed: 1000MIPS
- Connectivity: Configurable
- Peripherals: -
- Number of I/O: 73
- Program Memory Size: 128KB (32K x 32)
- Program Memory Type: SRAM
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
- Data Converters: A/D 8x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 217-LFBGA
- Supplier Device Package: 217-FBGA (16x16)
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