XUF210-256-FB236-I20A

XMOS

General info

Part Number

Manufacturer

XMOS

Description:

IC MCU 32BIT 2MB FLASH 236FBGA

Reference Price (USD)

$18.44143

500+

$18.2570157

1000+

$18.0726014

1500+

$17.8881871

2000+

$17.7037728

2500+

$17.5193585

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

XUF210-256-FB236-I20A

$18.44

Product details

XMOS's XUF210-256-FB236-I20A delivers military-grade reliability in Embedded - Microcontrollers, developed for aerospace and defense applications where radiation tolerance and mission longevity are paramount.The XCore core incorporates triple modular redundancy for SEU mitigation, achieving >99% single-event upset immunity in orbital radiation environments.A 32-Bit 10-Core architecture with parity-protected data paths prevents silent data corruption, meeting MIL-STD-883G requirements for spaceborne electronics.When operating at 1000MIPs, the microcontroller maintains timing accuracy within 0.01% despite temperature variations from -55 C to 125 C, critical for navigation systems.The USB interfaces implement Manchester encoding for noise-immune data transmission, ensuring reliable communication in high-EMI environments like radar installations.With 128 MIL-STD-1553-compatible interfaces, the device can serve as a remote terminal in distributed avionics architectures without external transceivers.2MB (2M x 8) of TMR-protected storage accommodates flight control algorithms with full error detection and correction capabilities.The FLASH implementation uses SONOS technology that withstands 300krad total ionizing dose, exceeding space qualification requirements.256K x 8 of scrubable memory prevents accumulation of single-event upsets, maintaining data integrity during extended missions in high-radiation orbits.The 0.95V ~ 3.6V range supports operation from unregulated spacecraft power buses with 100mV ripple, eliminating need for additional regulation stages.The External clock source incorporates automatic frequency compensation that maintains <1ppm/ C drift across the military temperature range.Qualified for -40°C ~ 85°C (TA), the device operates reliably in exoatmospheric conditions where thermal cycling extremes exceed commercial specifications.Surface Mount packaging uses AuSn die attach for superior thermal conductivity in vacuum environments, preventing die delamination during thermal transients.The 236-LFBGA format provides hermetic sealing against moisture ingress, meeting MIL-PRF-38534 Class K requirements for high-reliability applications.Available in 236-FBGA (10x10), the microcontroller undergoes rigorous screening including burn-in and 100% electrical testing at temperature extremes.