10AS022C3U19E2SG
Intel
10AS022C3U19E2SG
Intel
IC SOC CORTEX-A9 1.5GHZ 484UBGA
Reference Price (USD)
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$867.24000
500+
$858.5676
1000+
$849.8952
1500+
$841.2228
2000+
$832.5504
2500+
$823.878
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Product details
The 10AS022C3U19E2SG by Intel is a breakthrough in Embedded - System On Chip (SoC), designed for ultra-low-power IoT edge devices. This SoC combines energy-efficient processing with advanced sleep modes, making it perfect for battery-powered applications where power consumption and signal integrity are crucial for extended operational life.Utilizing a MCU, FPGA architecture, the device achieves unprecedented power efficiency while maintaining reliable data throughput for sensor fusion applications.The Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core delivers optimal performance-per-watt ratios, enabling complex edge AI computations within tight energy budgets.With 256KB of ultra-low-leakage RAM, the processor maintains data retention during deep sleep modes critical for energy harvesting systems.Integrated DMA, POR, WDT include precision ADCs and wireless interfaces that eliminate the need for external components in compact designs.The EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG options support both short-range and LPWAN protocols, ensuring seamless integration into diverse IoT ecosystems.Operating at 1.5GHz, the processor balances performance with power efficiency for always-on sensing applications.FPGA - 220K Logic Elements feature hardware-accelerated encryption engines that secure device-to-cloud communications without compromising battery life.Rated for 0°C ~ 100°C (TJ), the component maintains reliable operation in extreme environmental monitoring applications.The 484-BFBGA package enables ultra-compact designs while providing robust thermal characteristics.Available in 484-UBGA (19x19), the device supports automated assembly processes for high-volume IoT product manufacturing.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 220K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 484-BFBGA
- Supplier Device Package: 484-UBGA (19x19)