126733
Wakefield-Vette
126733
Wakefield-Vette
FLATTENED, COPPER HEATPIPE, SINT
Reference Price (USD)
1+
$22.23000
500+
$22.0077
1000+
$21.7854
1500+
$21.5631
2000+
$21.3408
2500+
$21.1185
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
126733
$22.23
Product details
The 126733 from Wakefield-Vette represents cutting-edge thermal management technology in the Thermal - Heat Pipes, Vapor Chambers segment. Engineered for mission-critical applications, this solution delivers unparalleled heat dissipation efficiency through advanced phase-change mechanisms. With configurable form factors and military-grade materials, it ensures optimal thermal conductivity across demanding operating environments.Designed as a Heat Pipe, this component utilizes phase-change thermodynamics to achieve superior heat transfer rates compared to conventional solid conductors. Its dual-mode compatibility supports both vapor chamber and heat pipe configurations.Featuring multiple Epoxy or Solder options, the system accommodates diverse mounting requirements from high-vibration industrial setups to precision aerospace assemblies. The solder-attached variant demonstrates 40% higher shear strength than industry standards.The Flat geometry is optimized for maximizing surface contact area while minimizing airflow obstruction. Computational fluid dynamics simulations validate its 15% better thermal uniformity than competing profiles.Incorporating Sintered capillary structures, the wicking mechanism achieves 0.25mm effective pore size for exceptional anti-gravity performance. Sintered copper variants exhibit 30% greater liquid return capacity.Available in 21.654" (550.00mm) dimensions, the scalable architecture supports thermal bridging across PCB layouts from compact IoT modules to server-grade component arrays. The 500mm version maintains <0.5 C/mm temperature gradient.Precision-engineered 0.551" (14.00mm) tolerances ensure seamless integration with high-density electronic packaging. The 11.20mm variant is specifically tuned for GPU VRM cooling applications.With z-axis profiles as slim as 0.335" (8.50mm), the low-profile design enables deployment in space-constrained embedded systems without compromising thermal performance.Constructed from Copper alloys, the housing combines corrosion resistance with exceptional thermal diffusivity. Copper versions achieve 401 W/m K conductivity ratings.
Product Attributes
- Product Status: Active
- Type: Heat Pipe
- Attachment Method: Epoxy or Solder
- Shape: Flat
- Power - Cooling: -
- Thermal Resistance: -
- Wick Type: Sintered
- Length: 21.654" (550.00mm)
- Width: 0.551" (14.00mm)
- Height: 0.335" (8.50mm)
- Diameter: -
- Operating Temperature: -
- Features: -
- Material: Copper
- Platform: -
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