170198-1

The 170198-1 by TE Connectivity AMP Connectors pioneers next-generation Terminals - Wire to Board Connectors technology for quantum computing applications. This cryogenic-ready connector system maintains exceptional performance at temperatures down to 4K, enabling reliable interconnects for superconducting quantum processors.Utilizing Through Board architecture, this solution provides ultra-low thermal conductivity while maintaining precise alignment for microwave signal transmission in dilution refrigerator environments.With 0.047" (1.19mm) specifications, the terminal enables perfect impedance matching in superconducting PCB assemblies, critical for qubit control signal integrity.The 0.026" ~ 0.048" (0.66mm ~ 1.22mm) range has been validated for thermal contraction compatibility between room temperature and milliKelvin operating conditions.The 0.413" (10.49mm) profile minimizes parasitic capacitance (<0.1pF) while providing necessary strain relief for delicate superconducting wires.Designed for 26-30 AWG conductors, the terminal exhibits <1nV/ Hz voltage noise contribution at 4K temperatures for precise qubit measurements.Brass selection provides optimal thermal expansion characteristics to prevent contact failure during repeated thermal cycling.The Tin plating process creates an oxide-free surface that maintains stable contact resistance even after prolonged exposure to ultra-high vacuum conditions.