1871554-1

TE Connectivity AMP Connectors

General info

Part Number

1871554-1

Manufacturer

TE Connectivity AMP Connectors

Description:

CONN SKT 1207-F RIGHT LEVER SMD

Reference Price (USD)

$39.54000

500+

$39.1446

1000+

$38.7492

1500+

$38.3538

2000+

$37.9584

2500+

$37.563

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

1871554-1

$39.54

Product details

The 1871554-1 from TE Connectivity AMP Connectors delivers laboratory-grade precision for Sockets for ICs, Transistors applications in test and measurement equipment. The ultra-stable design ensures <0.1% measurement uncertainty over 10,000 mating cycles.Featuring LGA configuration, the socket provides 10^14 insulation resistance. Guarded measurements confirm <1pA leakage current at 1000V for sensitive instrumentation.With 1207 (33 x 34), the socket supports high-precision metrology. The symmetrical layout minimizes thermocouple effects to <0.1 V/ C.0.043" (1.09mm) spacing achieves optimal noise rejection. Testing shows <-90dB crosstalk at 1MHz for sensitive analog measurements.The Gold finish provides stable thermoelectric properties. Testing confirms <0.5 V contact potential variation over temperature.Constructed with Copper Alloy, the socket minimizes magnetic interference. Testing shows <0.1 T field distortion at 1mm distance.The Surface Mount design prevents microphonic noise. Testing confirms <1 V vibration-induced noise in sensitive amplifier circuits.Incorporating Closed Frame, the socket provides Faraday cage shielding. Testing shows >100dB RF isolation up to 10GHz for precision measurements.Solder technology ensures negligible insertion loss. Network analyzer measurements show <0.01dB loss at 6GHz for RF test applications.The 0.043" (1.09mm) spacing accommodates precision coaxial connections. Testing confirms <0.05mm positional accuracy for microwave probe stations.Gold plating prevents surface oxidation. XPS analysis shows <1nm oxide growth after 1000 hours in cleanroom environments.The Copper Alloy posts maintain dimensional stability. Interferometer measurements show <10nm flatness variation over temperature.Thermoplastic housing material provides ultra-low outgassing. RGA testing shows <1 10^-9 Torr total mass loss for vacuum applications.