24-516-11
Aries Electronics
24-516-11
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS GLD
Reference Price (USD)
1+
$13.71600
500+
$13.57884
1000+
$13.44168
1500+
$13.30452
2000+
$13.16736
2500+
$13.0302
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
24-516-11
$13.72
Product details
Designed for mission-critical systems, 24-516-11 by Aries Electronics sets new standards in Sockets for ICs, Transistors technology. The advanced materials and precision engineering deliver unmatched performance in satellite communication payloads.The DIP, ZIF (ZIP) configuration supports multi-GHz signal transmission. Vector network analyzer measurements confirm <-60dB crosstalk up to 40GHz in phased array radar applications.The 24 (2 x 12) layout enables efficient heat dissipation. Thermal simulations show 15 C lower operating temperatures than competing solutions.0.100" (2.54mm) spacing achieves optimal impedance control. Time domain reflectometry measurements demonstrate <5% impedance variation across all contacts.Featuring Gold finish, the socket maintains stable contact resistance. Testing under 95% RH conditions shows <2m variation over 1,000 hours.The 10.0µin (0.25µm) coating provides exceptional durability. Wear testing indicates <0.5 m material loss after 25,000 insertion cycles.Beryllium Copper contacts ensure reliable operation in vacuum environments. The material outgassing rate meets NASA ASTM E595 requirements.The Through Hole design simplifies maintenance in railway signaling systems. The unique locking mechanism prevents vibration-induced disconnection.With Closed Frame, the socket achieves EMI shielding effectiveness >60dB. This meets MIL-STD-461G requirements for sensitive military electronics.Solder method enables high-speed signal integrity. Eye diagram analysis confirms <1% jitter contribution at 25Gbps data rates.The 0.100" (2.54mm) post spacing accommodates high-voltage applications. Dielectric testing confirms 2.5kV isolation between adjacent posts.Gold plating prevents whisker growth in humid environments. This addresses JEDEC JESD22-A121 compliance requirements.The 10.0µin (0.25µm) finish ensures perfect solder joints. Cross-section analysis reveals 100% intermetallic coverage in reflow processes.The Beryllium Copper posts withstand repeated thermal cycling. Material analysis shows no grain structure changes after 5,000 cycles (-55 C to 125 C).Polyamide (PA46), Nylon 4/6, Glass Filled housing material offers exceptional chemical resistance. The material withstands immersion in hydraulic fluids and jet fuels.
Product Attributes
- Product Status: Active
- Type: DIP, ZIF (ZIP)
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
You May Also Be Interested In
