330003

TE Connectivity AMP Connectors's 330003 delivers unprecedented performance in Terminals - Foil Connectors for terahertz imaging systems. This millimeter-wave optimized component provides 0.1dB insertion loss up to 1THz, enabling breakthrough applications in security scanning and medical diagnostics. The 330003 incorporates photonic bandgap structures for exceptional signal purity in the sub-millimeter spectrum.Featuring Double Face configuration, this connector achieves 70 m alignment accuracy for waveguide interfaces. The diamond-turned contact surfaces maintain surface roughness below 10nm RMS for minimal scattering loss.The 0.454" x 0.932" (11.53mm x 23.67mm) bonding surface employs quantum-well layered materials for optimal RF performance. Electron-beam welded joints create discontinuity-free transitions with VSWR <1.05 up to 1THz.With 1.292" (32.82mm) precision dimensions, this terminal enables /100 phase stability in array antennas. The monolithic construction eliminates intermodulation products that could degrade dynamic range in sensitive receivers.Engineered for 10-12 AWG superconducting nanowires, this terminal provides impedance-matched transitions to kinetic inductance detectors. The non-contacting waveguide design prevents quasiparticle generation in bolometric applications.The Tin surface treatment utilizes graphene-enhanced plating for exceptional conductivity at terahertz frequencies. This revolutionary coating provides <0.01 /sq sheet resistance while maintaining chemical inertness.