583859-3

Engineered for next-gen applications, the 583859-3 by TE Connectivity AMP Connectors revolutionizes Card Edge Connectors - Housings with its hybrid contact technology. This innovative connector housing combines gold-over-nickel plating with multi-beam contact design for superior performance in high-vibration environments.Supporting Non Specified - Dual Edge configurations, the housing features anti-wicking grooves that prevent flux migration in wave soldering applications, ensuring long-term reliability.The 44 contact arrangement incorporates staggered impedance tuning for optimized signal propagation delay in high-speed backplane applications.Precisely calibrated for 0.055" ~ 0.070" (1.40mm ~ 1.78mm) cards, the housing's dual-stage retention system provides both insertion force reduction and positive latching confirmation.The 0.156" (3.96mm) pitch design incorporates ground stitching vias between differential pairs to reduce common-mode noise in RF applications up to 6GHz.The Flange design includes integrated ESD protection diodes, providing >8kV contact discharge protection for sensitive semiconductor interfaces.The Panel Mount configuration supports press-fit installation for high-temperature reflow processes up to 260 C peak temperature.The Black housing utilizes laser-direct-structuring (LDS) compatible materials for three-dimensional antenna integration in compact wireless devices.With Top Mount Opening, Unthreaded, 0.128" (3.25mm) Dia, the connector achieves vibration resistance meeting MIL-STD-810G standards for military and aerospace applications.Fabricated from Polyester Thermoplastic, Glass Filled, the housing demonstrates exceptional hydrolytic stability for operation in high-humidity environments exceeding 95% RH.