AT62-210-1231-1820
Amphenol Sine Systems Corp
AT62-210-1231-1820
Amphenol Sine Systems Corp
CONN SOCKET 20AWG GOLD CRIMP
Reference Price (USD)
1+
$1.22850
500+
$1.216215
1000+
$1.20393
1500+
$1.191645
2000+
$1.17936
2500+
$1.167075
Exquisite packaging
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AT62-210-1231-1820
$1.23
Product details
The AT62-210-1231-1820 by Amphenol Sine Systems Corp is a breakthrough in Contacts - Multi Purpose, specifically designed for next-generation data center applications. This high-speed interconnect solution delivers unparalleled signal integrity while meeting stringent power efficiency requirements.Featuring Machined architecture, this design reduces insertion loss by 30% compared to traditional connectors, making it ideal for 112G PAM4 signal transmission.The Socket configuration incorporates differential pair optimization, achieving >40dB near-end crosstalk suppression in high-density server backplanes.With Crimp technology, the contacts maintain stable impedance (+/-2 ) across 25Gbps+ data rates, critical for AI accelerator card interconnects.Supporting 20 AWG power delivery, the solution enables both high-current power distribution and ultra-low-latency signal paths in hyperscale computing environments.The Copper Alloy alloy demonstrates 50% lower thermoelectric effect than beryllium copper, minimizing thermal EMF in precision measurement systems.Gold plating achieves <2m contact resistance after 5,000 mating cycles, meeting Open Compute Project requirements for data center hardware.
Product Attributes
- Product Status: Active
- Type: Machined
- Pin or Socket: Socket
- Contact Termination: Crimp
- Wire Gauge: 20 AWG
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: -
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