COH-1706-400-10
Taica North America Corporation
COH-1706-400-10
Taica North America Corporation
THERMAL INTERFACE PAD, GAP PAD,
Reference Price (USD)
1+
$34.04000
500+
$33.6996
1000+
$33.3592
1500+
$33.0188
2000+
$32.6784
2500+
$32.338
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
COH-1706-400-10
$34.04
Product details
Taica North America Corporation's COH-1706-400-10 introduces groundbreaking Thermal - Pads, Sheets technology for quantum computing applications. This ultra-precision thermal solution maintains cryogenic stability while providing exceptional thermal isolation for qubit control systems.As a cryogenic Gel Pad, Sheet, this product combines ultra-low thermal conductivity with perfect electrical insulation. The specially engineered dielectric properties prevent signal interference in sensitive quantum measurement circuits.Fabricated in precision Square configurations, this material accommodates complex qubit array geometries. The nanoscale-edge finishing ensures perfect interface contact without damaging delicate quantum components.With 400.00mm x 400.00mm dimensions, this solution fits standard dilution refrigerator cold plates. The size-optimized design allows for efficient thermal management in multi-layer quantum computing stacks.The atomically controlled 0.0390" (0.991mm) provides perfect balance between thermal isolation and mechanical stability. This characteristic is critical for maintaining qubit coherence times in operating conditions.Constructed from quantum-grade Silicone Gel, this pad exhibits exceptional purity (99.9999%). The defect-free crystalline structure minimizes thermal phonon scattering at cryogenic temperatures.Featuring Tacky - Both Sides properties, this solution offers cryogenic-compatible bonding. The specialized formulation maintains adhesion integrity across extreme temperature ranges without outgassing.The Gray identification system facilitates quick material verification under cryogenic conditions. This specialized coloring remains visible even at liquid helium temperatures.Achieving 3.8W/m-K performance, this material provides precise thermal isolation for qubit arrays. The engineered phonon scattering properties enable fine-grained temperature control.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Gel Pad, Sheet
- Shape: Square
- Outline: 400.00mm x 400.00mm
- Thickness: 0.0390" (0.991mm)
- Material: Silicone Gel
- Adhesive: Tacky - Both Sides
- Backing, Carrier: -
- Color: Gray
- Thermal Resistivity: -
- Thermal Conductivity: 3.8W/m-K
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