CYPD2105-20FNXIT
Infineon Technologies
CYPD2105-20FNXIT
Infineon Technologies
IC MCU 32BIT 32KB FLASH 20WLCSP
Reference Price (USD)
1+
$3.03000
500+
$2.9997
1000+
$2.9694
1500+
$2.9391
2000+
$2.9088
2500+
$2.8785
Exquisite packaging
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CYPD2105-20FNXIT
$3.03
Product details
Infineon Technologies's CYPD2105-20FNXIT reimagines Embedded - Microcontrollers - Application Specific for smart grid and power conversion applications. This application-specific microcontroller integrates advanced PWM generation with high-resolution ADC capabilities, enabling precise control of power electronics.Optimized for USB Type C implementations, the device features hardware-based overcurrent protection with 50ns response time. The integrated sigma-delta modulators enable direct sensorless motor control.The ARM® Cortex®-M0 core includes dedicated trigonometric acceleration units. The parallel execution pipelines achieve 95% duty cycle accuracy at 100kHz switching frequencies.Supporting FLASH (32KB) options, the flash memory incorporates shadow registers for bumpless firmware updates. The dual-plane architecture allows live updates during continuous operation.The 4K x 8 memory implements deterministic access timing for control loops. The dual-port architecture allows simultaneous access from CPU and PWM units.With I²C, SPI, UART/USART, USB connectivity, the device supports EtherCAT POWERLINK protocols. Each communication peripheral includes reinforced isolation meeting IEC 61800-5-1 standards.The 9 configurable ports feature 12-bit DAC outputs for analog control. Programmable dead-time insertion prevents shoot-through in bridge configurations.Operating from 1.71V ~ 5.5V inputs, the power architecture withstands 100V transients. The integrated gate drivers support SiC and GaN power devices.Certified for -40°C ~ 85°C (TA) operation, the package uses direct-bonded copper substrates. Thermal impedance is minimized for high-current applications.The Surface Mount option supports press-fit assembly for high-power PCBs. The package design accommodates thick copper layers for heat dissipation.Available in 20-UFBGA, WLCSP format, the package includes Kelvin sense connections. The low-inductance design minimizes switching losses at high di/dt rates.Supplied in 20-WLCSP (1.63x2.03) configuration, each unit includes power cycling test reports. Production testing includes 100% burn-in at maximum junction temperature.
Product Attributes
- Product Status: Active
- Applications: USB Type C
- Core Processor: ARM® Cortex®-M0
- Program Memory Type: FLASH (32KB)
- Controller Series: -
- RAM Size: 4K x 8
- Interface: I²C, SPI, UART/USART, USB
- Number of I/O: 9
- Voltage - Supply: 1.71V ~ 5.5V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-UFBGA, WLCSP
- Supplier Device Package: 20-WLCSP (1.63x2.03)
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