CYPD2704-09FNXIT
Infineon Technologies
Product details
Infineon Technologies's CYPD2704-09FNXIT redefines performance standards in Embedded - Microcontrollers - Application Specific, specifically developed for next-generation IoT edge nodes. This application-specific microcontroller combines ultra-low power consumption with robust security features, making it ideal for distributed sensor networks and smart city infrastructure.Designed for USB Type C implementations, the microcontroller's hardware security modules exceed FIPS-140-2 requirements. Its tamper-resistant design includes active shield technology for physical attack prevention.With I²C, USB connectivity options, the device supports deterministic industrial Ethernet protocols. Each interface includes integrated magnetics for simplified PoE (Power over Ethernet) implementations.The 2.7V ~ 5.5V power architecture implements adaptive body biasing for leakage current reduction. The integrated buck converter achieves 92% power efficiency across load variations.Certified for -40°C ~ 85°C (TA) operation, the device utilizes copper pillar bump technology for enhanced thermal conductivity. The package design minimizes thermal resistance to PCB substrates.The Surface Mount option supports reflow profiles compatible with lead-free SAC305 solder. Package warpage is controlled to <0.05mm for high-yield assembly processes.Available in 9-UFBGA, WLCSP format, the package incorporates stress-relief features for improved board-level reliability. Moisture sensitivity meets JEDEC J-STD-020D Level 3 standards.Supplied in 9-WLCSP (1.38x1.35) configuration, each unit includes unique cryptographic identifiers for supply chain authentication. Tape-and-reel packaging supports automated pick-and-place assembly.
Product Attributes
- Product Status: Active
- Applications: USB Type C
- Core Processor: -
- Program Memory Type: -
- Controller Series: -
- RAM Size: -
- Interface: I²C, USB
- Number of I/O: -
- Voltage - Supply: 2.7V ~ 5.5V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 9-UFBGA, WLCSP
- Supplier Device Package: 9-WLCSP (1.38x1.35)