EPG-06-004
Marlow Industries, Inc.
Product details
Designed for industrial IoT edge computing, Marlow Industries, Inc.'s EPG-06-004 advances Thermal - Thermoelectric, Peltier Assemblies technology with AI-optimized thermal management. This intelligent Peltier system dynamically adjusts cooling parameters to maintain optimal processor performance while conserving energy in distributed computing nodes.Delivering 7.4 W of adaptive cooling power, the module supports variable workloads in predictive maintenance gateways.Weighing 13 lbs (5.9 kg), the robust construction withstands mechanical shocks common in mobile industrial equipment.
Product Attributes
- Product Status: Active
- Heat Transfer Type: -
- Power - Cooling: 7.4 W
- Current: -
- Voltage: -
- Fan Location: -
- Power - Input: -
- Operating Temperature: -
- Weight: 13 lbs (5.9 kg)
- Dimensions - Overall: -