LX2162RE82029B
NXP USA Inc.
Product details
Designed for reliability in harsh environments, the LX2162RE82029B by NXP USA Inc. redefines performance standards in the Embedded - Microprocessors category. This industrial-grade microprocessor combines rugged construction with advanced processing capabilities, delivering exceptional EMC performance for mission-critical automation systems.Built around the ARM® Cortex®-A72 core architecture, the processor delivers consistent performance across varying load conditions, maintaining precise timing for industrial communication protocols.The 16 Core, 64-Bit configuration provides balanced resource allocation for both control and data plane processing in networked industrial devices.Operating at 2GHz, the device meets the real-time processing requirements of advanced predictive maintenance algorithms and condition monitoring systems.Supporting DDR4, SDRAM memory technologies, the processor accommodates various cost-performance points without compromising data integrity.No graphics capabilities enable visualization of complex process data without taxing the main processor cores.SATA 6Gbps (4) interfaces provide reliable high-speed storage connectivity for industrial data logging applications.With USB 3.0 (1) support, the device interfaces seamlessly with industrial peripherals and programming tools.Rated for 5°C ~ 105°C (TA) operation, the processor maintains stable performance in outdoor industrial equipment and transportation systems.The 1150-FBGA package incorporates enhanced mechanical robustness for vibration-prone applications.Available in 1150-FBGA (23x23), the device supports industrial-grade PCB manufacturing processes.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A72
- Number of Cores/Bus Width: 16 Core, 64-Bit
- Speed: 2GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR4, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: SATA 6Gbps (4)
- USB: USB 3.0 (1)
- Voltage - I/O: -
- Operating Temperature: 5°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 1150-FBGA
- Supplier Device Package: 1150-FBGA (23x23)