M82170G13
NXP USA Inc.
M82170G13
NXP USA Inc.
IC ETH ROUTER BB SOC 672BGA
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Product details
NXP USA Inc.'s M82170G13 revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The ARM® Cortex®-A9 core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 2 Core, 32-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 1.2GHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.High-bandwidth DDR3 memory interfaces support the massive data flows characteristic of 5G signal processing.GbE (3) implementations provide the necessary throughput for CPRI and eCPRI interfaces in 5G radios.SATA 3Gbps (2) interfaces provide local storage for network configuration and performance logging.USB 2.0 + PHY (1), USB 3.0 + PHY interfaces enable flexible configuration and debugging of network equipment during deployment.Rated for 0°C ~ 70°C (TA) operation, the processor maintains performance in outdoor radio unit installations.Carrier-grade Secure Boot, TrustZone® protect network infrastructure from both physical and cyber threats.The 672-BGA package design optimizes thermal performance for continuous high-load operation.Available in 672-TEPBGA (27x27), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Obsolete
- Core Processor: ARM® Cortex®-A9
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.2GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: GbE (3)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (1), USB 3.0 + PHY
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: Secure Boot, TrustZone®
- Package / Case: 672-BGA
- Supplier Device Package: 672-TEPBGA (27x27)
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