MIMX8MD6CVAHZAB
NXP USA Inc.
MIMX8MD6CVAHZAB
NXP USA Inc.
I.MX 8MDUAL 17X17 NO LID 621FBGA
Reference Price (USD)
1+
$80.60000
500+
$79.794
1000+
$78.988
1500+
$78.182
2000+
$77.376
2500+
$76.57
Exquisite packaging
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MIMX8MD6CVAHZAB
$80.60
Product details
NXP USA Inc.'s MIMX8MD6CVAHZAB revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The ARM® Cortex®-A53 core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 2 Core, 64-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 1.3GHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.The ARM® Cortex®-M4 units accelerate OFDM processing and channel coding algorithms.High-bandwidth DDR3L, DDR4, LPDDR4 memory interfaces support the massive data flows characteristic of 5G signal processing.Yes graphics capabilities enable visualization of network performance metrics in real-time.The eDP, HDMI, MIPI-CSI, MIPI-DSI interfaces support remote management consoles for network equipment.GbE implementations provide the necessary throughput for CPRI and eCPRI interfaces in 5G radios.USB 3.0 (2) interfaces enable flexible configuration and debugging of network equipment during deployment.Rated for -40°C ~ 105°C (TJ) operation, the processor maintains performance in outdoor radio unit installations.Carrier-grade ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS protect network infrastructure from both physical and cyber threats.The 621-FBGA, FCBGA package design optimizes thermal performance for continuous high-load operation.Available in 621-FCPBGA (17x17), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A53
- Number of Cores/Bus Width: 2 Core, 64-Bit
- Speed: 1.3GHz
- Co-Processors/DSP: ARM® Cortex®-M4
- RAM Controllers: DDR3L, DDR4, LPDDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
- Ethernet: GbE
- SATA: -
- USB: USB 3.0 (2)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
- Package / Case: 621-FBGA, FCBGA
- Supplier Device Package: 621-FCPBGA (17x17)
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