MIMX8MN1CVPIZAA
NXP USA Inc.
MIMX8MN1CVPIZAA
NXP USA Inc.
I.MX 8M NANO ULTRALITE
Reference Price (USD)
1+
$23.54161
500+
$23.3061939
1000+
$23.0707778
1500+
$22.8353617
2000+
$22.5999456
2500+
$22.3645295
Exquisite packaging
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MIMX8MN1CVPIZAA
$23.54
Product details
The MIMX8MN1CVPIZAA from NXP USA Inc. delivers military-grade reliability in the Embedded - Microprocessors category, hardened for aerospace and defense applications. This radiation-hardened microprocessor combines triple-modular redundancy with error-correcting architectures, meeting MIL-STD-883 requirements for mission-critical systems.Featuring a ARM® Cortex®-A53, ARM® Cortex®-M7 radiation-hardened core, the processor implements lockstep execution with cycle-by-cycle comparison for fault detection.The 2 Core, 64-Bit configuration includes redundant execution units for single-event upset mitigation in space applications.Operating at 1.4GHz, the device meets the real-time processing requirements of spacecraft attitude control systems.The Multimedia; NEON™ MPE units include radiation-hardened floating-point accelerators for spacecraft navigation.DDR3L, DDR4, LPDDR4 memory interfaces incorporate SECDED ECC protection for single-event upset mitigation in orbit.Yes display controllers include radiation-hardened frame buffers for critical spacecraft displays.The LCD, MIPI-CSI interfaces implement MIL-STD-1553 protocol support for aerospace databuses.GbE implementations include space-grade PHYs with enhanced EMI characteristics for spacecraft applications.The USB 2.0 OTG + PHY (1) interfaces meet MIL-STD-1275 requirements for military vehicle power environments.Qualified for -40°C ~ 105°C (TJ) operation, the processor functions in extreme space and high-altitude environments.Military-grade ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS include TEMPEST-approved cryptographic modules for secure communications.The 306-TFBGA package implements hermetic sealing for protection against moisture and contaminants.Available in 306-TFBGA (11x11), the device supports military-grade PCB assembly processes.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
- Number of Cores/Bus Width: 2 Core, 64-Bit
- Speed: 1.4GHz
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: DDR3L, DDR4, LPDDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: LCD, MIPI-CSI
- Ethernet: GbE
- SATA: -
- USB: USB 2.0 OTG + PHY (1)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
- Package / Case: 306-TFBGA
- Supplier Device Package: 306-TFBGA (11x11)
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