MIMX8MN5CVPIZAA
NXP USA Inc.
MIMX8MN5CVPIZAA
NXP USA Inc.
I.MX 8M NANO ULTRALITE
Reference Price (USD)
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$32.26000
500+
$31.9374
1000+
$31.6148
1500+
$31.2922
2000+
$30.9696
2500+
$30.647
Exquisite packaging
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MIMX8MN5CVPIZAA
$32.26
Product details
The MIMX8MN5CVPIZAA by NXP USA Inc. establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A53, ARM® Cortex®-M7 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 4 Core, 64-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 1.4GHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Multimedia; NEON™ MPE neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The DDR3L, DDR4, LPDDR4 memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.Yes GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.Supporting LCD, MIPI-CSI, MIPI-DSI outputs, the processor drives multiple high-resolution displays for AI visualization dashboards.GbE connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 2.0 OTG + PHY (1) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Rated for -40°C ~ 105°C (TJ) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS include model encryption and secure model update mechanisms for protected edge AI deployments.The 306-TFBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 306-TFBGA (11x11), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
- Number of Cores/Bus Width: 4 Core, 64-Bit
- Speed: 1.4GHz
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: DDR3L, DDR4, LPDDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
- Ethernet: GbE
- SATA: -
- USB: USB 2.0 OTG + PHY (1)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
- Package / Case: 306-TFBGA
- Supplier Device Package: 306-TFBGA (11x11)
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