MM908E622ACPEKR2
NXP USA Inc.
Product details
The MM908E622ACPEKR2 by NXP USA Inc. pioneers ultra-low-power design in Embedded - Microcontrollers - Application Specific, specifically developed for energy harvesting applications. This application-specific microcontroller operates down to 0.8V supply voltage, enabling battery-less IoT deployments with multi-year operation.Tailored for Automotive Mirror Control scenarios, the device includes nanowatt-range wake-up receivers. The energy-aware architecture achieves 98% duty cycle reduction through predictive sleep scheduling.Built around HC08 technology, the CPU features subthreshold operation modes. The event-driven architecture consumes just 12 A/MHz during active processing.The FLASH (16kB) organization supports shadow register banking for zero-energy state retention. The non-volatile memory maintains data at 0V supply through ferroelectric technology.As part of the 908E family, this microcontroller shares energy optimization tools with other members. The consistent power management API simplifies application development.The 512 x 8 memory implements ferroelectric retention for zero-power sleep. The memory controller includes energy-proportional access modes that scale with workload.Featuring SCI, SPI connectivity, the device includes sub-1GHz RF frontends. Each communication peripheral implements adaptive impedance matching for energy-optimized transmission.With 12 ports, the GPIO subsystem features piezoelectric driver circuits. Configurable charge pumps enable direct energy harvesting from mechanical vibrations.Operating from 9V ~ 16V sources, the power management unit starts at 300mV input. The integrated maximum power point tracker optimizes energy extraction from solar cells.Rated for -40°C ~ 85°C operation, the device uses zero-leakage transistors. The package design minimizes thermal gradients that could affect energy harvesting efficiency.The Surface Mount configuration supports flexible PCB installations. The ultra-thin package enables integration into wearable form factors.The 54-SSOP (0.295", 7.50mm Width) Exposed Pad option features transparent lids for solar cell integration. The package material selection maximizes light transmission to underlying photovoltaic layers.Available in 54-SOIC-EP format, each unit is tested with actual energy harvesting sources. Production includes verification of cold-start capability.
Product Attributes
- Product Status: Active
- Applications: Automotive Mirror Control
- Core Processor: HC08
- Program Memory Type: FLASH (16kB)
- Controller Series: 908E
- RAM Size: 512 x 8
- Interface: SCI, SPI
- Number of I/O: 12
- Voltage - Supply: 9V ~ 16V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 54-SOIC-EP