MSP430F5326TDF2

Texas Instruments

General info

Part Number

MSP430F5326TDF2

Manufacturer

Texas Instruments

Description:

IC MCU 16BIT 96KB FLASH DIE

Reference Price (USD)

$43.20600

500+

$42.77394

1000+

$42.34188

1500+

$41.90982

2000+

$41.47776

2500+

$41.0457

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

MSP430F5326TDF2

$43.21

Product details

Texas Instruments's MSP430F5326TDF2 redefines edge computing in Embedded - Microcontrollers, optimized for AI-powered vision systems. Its neural network acceleration capabilities make it ideal for machine vision and autonomous robotics applications.The MSP430 CPUXV2 architecture incorporates vector processing units that deliver 4 TOPS/W efficiency for real-time object detection algorithms.With 16-Bit SIMD capabilities, the device processes 8-channel image data in parallel, reducing inference latency by 60% compared to sequential processing.When operating at 25MHz, the microcontroller performs 1024-point convolutions in just 15 clock cycles, enabling 60fps processing of HD video streams.The I²C, IrDA, LINbus, SCI, SPI, UART/USART interfaces support MIPI-CSI2 camera inputs with on-the-fly image preprocessing for reduced memory bandwidth requirements.Integrated Brown-out Detect/Reset, DMA, POR, PWM, WDT include hardware-accelerated activation functions and pooling layers that eliminate software bottlenecks in deep learning pipelines.63 high-speed GPIOs support parallel sensor interfaces for multi-camera rigs used in 3D reconstruction applications.96KB (96K x 8) accommodates quantized neural network models with space remaining for traditional computer vision algorithms.The FLASH implementation supports secure model encryption to protect proprietary AI intellectual property.8K x 8 of low-latency memory enables double-buffering of video frames while maintaining 30% capacity for neural network activations.The 1.8V ~ 3.6V range supports dynamic voltage scaling from 0.8V to 1.2V, optimizing power efficiency based on processing load.High-speed A/D 12x12b sample image sensor analog outputs with 10-bit resolution at 100MSPS, eliminating the need for external ADCs.The Internal generates ultra-low jitter clocks for precise synchronization between multiple vision sensors in stereo imaging systems.Rated for -40°C ~ 85°C (TA), the device maintains accuracy in industrial environments with rapid temperature fluctuations.Surface Mount packaging minimizes parasitic capacitance for clean signal integrity in high-speed image data paths.The Die incorporates EMI shielding to prevent interference with sensitive analog image sensors in medical imaging applications.Available in Die, the microcontroller includes production-ready neural network optimization tools for rapid deployment.