MYC-C7Z010-4E1D-667-I

The MYC-C7Z010-4E1D-667-I by MYIR Tech Limited introduces groundbreaking innovation in the Embedded - Microcontroller, Microprocessor, FPGA Modules field, specifically tailored for AI-powered vision systems. Its neural processing capabilities combined with ultra-low latency make it perfect for real-time object recognition and machine vision applications in smart cities.Utilizing a MCU, FPGA architecture, this solution delivers unprecedented parallel processing density. The heterogeneous computing approach enables simultaneous execution of multiple neural networks while maintaining precise power sequencing for optimal thermal management.The ARM® Cortex®-A9 features dedicated tensor cores for accelerated AI workloads. Its multi-threaded architecture ensures deterministic performance in video analytics pipelines, crucial for surveillance systems requiring frame-by-frame accuracy.The Zynq-7000 (Z-7010) specializes in real-time image signal processing, delivering 16-bit color depth accuracy. This dedicated accelerator enables advanced features like multi-exposure HDR processing in industrial inspection cameras.Operating at 667MHz, the module achieves industry-leading inference speeds while maintaining power efficiency. The adaptive clock scaling technology dynamically adjusts frequency based on computational load in edge AI applications.With 32MB of high-endurance flash memory, the device supports multiple AI model storage. The wear-leveling algorithm extends memory lifespan in 24/7 operational security systems.The 1GB high-bandwidth memory enables real-time processing of 4K video streams. Its low-latency architecture is optimized for frame buffer management in multi-camera setups.The Board-to-Board (BTB) Socket - 280 interface provides robust connectivity for high-speed camera links. Its impedance-controlled design maintains signal integrity for 10Gbps data transmission in medical imaging systems.Measuring 2.95" x 2.17" (75mm x 55mm), this compact solution fits space-constrained embedded vision applications. The advanced packaging technology ensures reliable operation in vibration-prone robotics environments.Rated for -40°C ~ 85°C, the module performs reliably in outdoor smart traffic systems. The extended temperature validation includes 1000+ thermal cycles for automotive-grade reliability.