MYC-CZU3EG-4E4D-1200-C

The MYC-CZU3EG-4E4D-1200-C by MYIR Tech Limited introduces groundbreaking innovation in the Embedded - Microcontroller, Microprocessor, FPGA Modules field, specifically tailored for AI-powered vision systems. Its neural processing capabilities combined with ultra-low latency make it perfect for real-time object recognition and machine vision applications in smart cities.Utilizing a MPU, FPGA Core architecture, this solution delivers unprecedented parallel processing density. The heterogeneous computing approach enables simultaneous execution of multiple neural networks while maintaining precise power sequencing for optimal thermal management.The ARM® Cortex®-A53, ARM® Cortex®-R4 features dedicated tensor cores for accelerated AI workloads. Its multi-threaded architecture ensures deterministic performance in video analytics pipelines, crucial for surveillance systems requiring frame-by-frame accuracy.The Xilinx Zynq UltraScale+ ZU3EG/4EV/5EV specializes in real-time image signal processing, delivering 16-bit color depth accuracy. This dedicated accelerator enables advanced features like multi-exposure HDR processing in industrial inspection cameras.Operating at 600MHz, 1.5GHz, the module achieves industry-leading inference speeds while maintaining power efficiency. The adaptive clock scaling technology dynamically adjusts frequency based on computational load in edge AI applications.With 4GB of high-endurance flash memory, the device supports multiple AI model storage. The wear-leveling algorithm extends memory lifespan in 24/7 operational security systems.The 4GB high-bandwidth memory enables real-time processing of 4K video streams. Its low-latency architecture is optimized for frame buffer management in multi-camera setups.The Header interface provides robust connectivity for high-speed camera links. Its impedance-controlled design maintains signal integrity for 10Gbps data transmission in medical imaging systems.Measuring 2.36" x 2.05" (60mm x 52mm), this compact solution fits space-constrained embedded vision applications. The advanced packaging technology ensures reliable operation in vibration-prone robotics environments.Rated for 0°C ~ 70°C, the module performs reliably in outdoor smart traffic systems. The extended temperature validation includes 1000+ thermal cycles for automotive-grade reliability.