P1015NSE5DFB
NXP USA Inc.
P1015NSE5DFB
NXP USA Inc.
IC MPU Q OR IQ 667MHZ 561TEBGA1
Reference Price (USD)
1+
$68.92000
500+
$68.2308
1000+
$67.5416
1500+
$66.8524
2000+
$66.1632
2500+
$65.474
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
P1015NSE5DFB
$68.92
Product details
NXP USA Inc.'s P1015NSE5DFB sets new benchmarks in the Embedded - Microprocessors market segment, optimized for compute-intensive embedded applications. This system-on-chip solution integrates advanced processing cores with sophisticated power management, delivering exceptional performance-per-watt characteristics for energy-conscious designs.The PowerPC e500v2 architecture provides deterministic execution of real-time tasks while maintaining low power consumption, making it particularly suitable for battery-powered edge computing devices.Architected with 1 Core, 32-Bit capability, the processor enables efficient task partitioning and memory bandwidth utilization in multi-threaded applications.With clock speeds up to 667MHz, the device meets the computational demands of advanced motor control algorithms and power conversion systems.The Security; SEC 3.3 acceleration units significantly enhance performance for matrix operations common in AI inference tasks.Support for DDR3 memory technologies allows designers to optimize system cost and performance for specific application requirements.The No graphics subsystem enables smooth rendering of complex graphical user interfaces without external GPU components.10/100/1000Mbps (3) connectivity options provide the necessary bandwidth for industrial communication protocols including EtherCAT and PROFINET.USB 2.0 + PHY (2) implementations adhere to the latest USB standards, ensuring backward compatibility while supporting high-speed data transfers.Qualified for 0°C ~ 125°C (TA) operation, the processor reliably functions in outdoor telecommunications equipment and base station applications.Comprehensive Cryptography, Random Number Generator protect against both physical and network-based attacks, crucial for financial terminals and secure access systems.The 561-FBGA package design incorporates advanced thermal management features for reliable operation in confined spaces.Offered in 561-TEPBGA I (23x23), the device supports both conventional and advanced PCB assembly techniques.
Product Attributes
- Product Status: Obsolete
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 667MHz
- Co-Processors/DSP: Security; SEC 3.3
- RAM Controllers: DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000Mbps (3)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 125°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 561-FBGA
- Supplier Device Package: 561-TEPBGA I (23x23)
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