R7S921053VCBG#AC0
Renesas Electronics America Inc
R7S921053VCBG#AC0
Renesas Electronics America Inc
32BIT MCU RZ/A2M 4MB RAM BGA324
Reference Price (USD)
1+
$26.39000
500+
$26.1261
1000+
$25.8622
1500+
$25.5983
2000+
$25.3344
2500+
$25.0705
Exquisite packaging
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R7S921053VCBG#AC0
$26.39
Product details
The R7S921053VCBG#AC0 by Renesas Electronics America Inc establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A9 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 1 Core architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 528MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Multimedia; NEON™ MPE neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.Yes GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.Supporting LCD, LVDS, MIPICSI2, Video outputs, the processor drives multiple high-resolution displays for AI visualization dashboards.The USB 2.0 (1) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Rated for -40°C ~ 85°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 include model encryption and secure model update mechanisms for protected edge AI deployments.The 324-FBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 324-FBGA (19x19), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A9
- Number of Cores/Bus Width: 1 Core
- Speed: 528MHz
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: -
- Graphics Acceleration: Yes
- Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video
- Ethernet: -
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
- Package / Case: 324-FBGA
- Supplier Device Package: 324-FBGA (19x19)
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