S70-220101045R
Harwin Inc.
S70-220101045R
Harwin Inc.
CONTACT SMD GOLD
Reference Price (USD)
1+
$0.43000
500+
$0.4257
1000+
$0.4214
1500+
$0.4171
2000+
$0.4128
2500+
$0.4085
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
S70-220101045R
$0.43
Product details
Harwin Inc.'s S70-220101045R advances Contacts, Spring Loaded (Pogo Pins), and Pressure technology for IoT devices, combining {Mating Cycles} durability with ultra-low power characteristics. The {Contact Finish} finish at {Contact Finish Thickness} ensures stable contact resistance for energy-efficient sensor networks and wearable electronics.The innovative Contact Pad design minimizes power loss while maximizing connection reliability in intermittent-contact applications.Surface Mount mounting flexibility supports both rigid and flexible PCB implementations common in IoT devices.IoT-optimized Oval - 0.079" L x 0.039" W x 0.004" H (2.00mm x 1.00mm x 0.10mm) pad layout conserves space while maintaining reliable connections.Selected Beryllium Copper provides the ideal balance between conductivity and mechanical life for IoT use cases.
Product Attributes
- Product Status: Active
- Contact Type: Contact Pad
- Mounting Type: Surface Mount
- Maximum Working Height: -
- Recommended Working Height: -
- Minimum Working Height: -
- Pad Layout Dimension: Oval - 0.079" L x 0.039" W x 0.004" H (2.00mm x 1.00mm x 0.10mm)
- Operating Force - Initial: -
- Operating Force - Mid Compression: -
- Plunger Size: -
- Features: -
- Mating Cycles: -
- Contact Material: Beryllium Copper
- Contact Finish: Gold
- Contact Finish Thickness: Flash
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