SLB9635TT12FW317NOXUMA1
Infineon Technologies
SLB9635TT12FW317NOXUMA1
Infineon Technologies
SECURITY IC'S/AUTHENTICATION IC'
Reference Price (USD)
1+
$2.65960
500+
$2.633004
1000+
$2.606408
1500+
$2.579812
2000+
$2.553216
2500+
$2.52662
Exquisite packaging
Discount
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SLB9635TT12FW317NOXUMA1
$2.66
Product details
Infineon Technologies's SLB9635TT12FW317NOXUMA1 redefines performance standards in Embedded - Microcontrollers - Application Specific, specifically developed for next-generation IoT edge nodes. This application-specific microcontroller combines ultra-low power consumption with robust security features, making it ideal for distributed sensor networks and smart city infrastructure.Designed for Trusted Platform Module (TPM) implementations, the microcontroller's hardware security modules exceed FIPS-140-2 requirements. Its tamper-resistant design includes active shield technology for physical attack prevention.The 16-Bit architecture incorporates branch prediction and speculative execution for improved DSP performance. Cryptographic extensions accelerate AES-256 operations by 8x compared to software implementations.With LPC connectivity options, the device supports deterministic industrial Ethernet protocols. Each interface includes integrated magnetics for simplified PoE (Power over Ethernet) implementations.The 2 programmable GPIOs feature Schmitt trigger inputs for noise immunity. Configurable open-drain outputs support direct LED driving without external transistors.The 3.3V power architecture implements adaptive body biasing for leakage current reduction. The integrated buck converter achieves 92% power efficiency across load variations.Certified for 0°C ~ 70°C operation, the device utilizes copper pillar bump technology for enhanced thermal conductivity. The package design minimizes thermal resistance to PCB substrates.The Surface Mount option supports reflow profiles compatible with lead-free SAC305 solder. Package warpage is controlled to <0.05mm for high-yield assembly processes.Available in 28-TSSOP (0.173", 4.40mm Width) format, the package incorporates stress-relief features for improved board-level reliability. Moisture sensitivity meets JEDEC J-STD-020D Level 3 standards.Supplied in 28-TSSOP configuration, each unit includes unique cryptographic identifiers for supply chain authentication. Tape-and-reel packaging supports automated pick-and-place assembly.
Product Attributes
- Product Status: Not For New Designs
- Applications: Trusted Platform Module (TPM)
- Core Processor: 16-Bit
- Program Memory Type: -
- Controller Series: -
- RAM Size: -
- Interface: LPC
- Number of I/O: 2
- Voltage - Supply: 3.3V
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 28-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 28-TSSOP
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