SOMDM3730-10-2782IFCR

Beacon EmbeddedWorks's SOMDM3730-10-2782IFCR represents a paradigm shift in Embedded - Microcontroller, Microprocessor, FPGA Modules technology, engineered for next-generation data center acceleration. Its hardware-optimized architecture delivers breakthrough performance for hyperscale computing and network function virtualization workloads.The MPU, DSP Core design incorporates silicon photonics integration for high-speed data movement. This innovative approach reduces power consumption by 40% compared to traditional electrical interconnects in cloud server applications.Featuring the ARM® Cortex®-A8, DM3730 with 256-bit vector processing units, this solution accelerates complex data analytics. The multi-die architecture enables seamless scaling for demanding database acceleration tasks in financial services.The TMS320C64x (DSP) provides dedicated hardware for cryptographic operations, achieving 100Gbps encryption throughput. This security engine meets FIPS 140-3 Level 4 requirements for government cloud infrastructure.With a base clock of 1GHz, the processor maintains consistent performance across all cores. The advanced clock mesh distribution ensures minimal skew in large-scale server deployments.The 512MB (NAND), 8MB (NOR) persistent memory supports in-memory database acceleration. Its byte-addressable architecture reduces latency by 10x compared to traditional storage in big data applications.256MB of HBM2E memory delivers 460GB/s bandwidth for memory-intensive workloads. The 3D-stacked design optimizes space utilization in high-density server racks.The Board-to-Board (BTB) Socket - 480 interface supports 400G Ethernet connectivity for next-gen data centers. Its crosstalk suppression technology maintains signal integrity in fully populated switch fabrics.The 1.23" x 3.01" (31.2mm x 76.5mm) form factor complies with OCP accelerator module specifications. The innovative cooling solution enables 300W TDP operation in constrained server environments.Designed for 0°C ~ 70°C, the solution operates reliably in liquid-cooled data centers. The corrosion-resistant packaging withstands direct-contact cooling fluids.