TDA4VM88TGBALFRQ1
Texas Instruments
TDA4VM88TGBALFRQ1
Texas Instruments
NEXT GENERATION SOC FAMILY FOR L
Reference Price (USD)
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$123.89000
500+
$122.6511
1000+
$121.4122
1500+
$120.1733
2000+
$118.9344
2500+
$117.6955
Exquisite packaging
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TDA4VM88TGBALFRQ1
$123.89
Product details
Engineered for next-generation automotive electronics, Texas Instruments's TDA4VM88TGBALFRQ1 redefines Embedded - System On Chip (SoC) performance in vehicular applications. This advanced SoC combines automotive-grade reliability with sophisticated power management, making TDA4VM88TGBALFRQ1 the ideal choice for ADAS systems where signal integrity and functional safety are paramount.The dual-core DSP, MCU, MPU architecture provides redundant processing paths that meet ASIL-D requirements for autonomous driving subsystems.Featuring the ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x, the device delivers the computational density needed for real-time sensor fusion while meeting stringent automotive power budgets.With 1.5MB of error-protected RAM, the processor maintains data coherence during sudden power fluctuations common in automotive environments.Automotive-specific DMA, PWM, WDT include CAN-FD controllers and automotive Ethernet MACs, reducing the need for external interface chips.The comprehensive MCAN, MMC/SDSD/IOI²C, SPI, UART, USB suite supports in-vehicle network topologies while providing robust EMI performance essential for automotive applications.Operating at 2GHz, 1GHz, 1.35GHz, 1GHz, the processor meets the real-time processing requirements of high-resolution radar and lidar systems.Qualified for -40°C ~ 125°C (TJ), the component maintains precise timing references across the full automotive temperature range.The 827-BFBGA, FCBGA package features automotive-grade materials that withstand thermal shock and mechanical vibration.Available in 827-FCBGA (24x24), the device meets AEC-Q100 Grade 1 requirements for automotive electronics.
Product Attributes
- Product Status: Active
- Architecture: DSP, MCU, MPU
- Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
- Flash Size: -
- RAM Size: 1.5MB
- Peripherals: DMA, PWM, WDT
- Connectivity: MCAN, MMC/SDSD/IOI²C, SPI, UART, USB
- Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
- Primary Attributes: -
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 827-BFBGA, FCBGA
- Supplier Device Package: 827-FCBGA (24x24)
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