VCH2185
Radian
Product details
Radian's VCH2185 redefines thermal management benchmarks in the Thermal - Heat Pipes, Vapor Chambers category. Optimized for next-generation computing architectures, this thermal solution combines innovative wick structures with military-spec construction for reliable operation in harsh conditions.Functioning as a Vapor Chamber, the device employs two-phase heat transfer principles to achieve 5x better thermal conductivity than copper blocks. The vapor chamber variant features micro-channel reinforcement for 400W+ applications.Supporting Push Pin installation techniques, the system accommodates both permanent and serviceable thermal interfaces. Epoxy-mounted versions demonstrate 1000+ thermal cycles reliability.The Rectangular configuration is aerodynamically optimized for forced convection systems. Rectangular profiles show 18% lower pressure drop in wind tunnel tests.Available in 4.606" (117.00mm) variants, the modular design enables custom thermal path optimization. The 450mm version is specifically engineered for rack-mounted server cooling.Precision-machined to 3.543" (90.00mm) specifications, the contact surfaces ensure <0.01mm flatness for optimal TIM performance. The 56mm variant supports chipset array cooling.With 1.087" (27.60mm) vertical clearance, the ultra-slim profile fits 1U chassis configurations while maintaining 100W cooling capacity.Fabricated from Copper substrates, the construction balances weight and performance. Aluminum versions achieve 230 W/m K conductivity at 40% weight reduction.
Product Attributes
- Product Status: Active
- Type: Vapor Chamber
- Attachment Method: Push Pin
- Shape: Rectangular
- Power - Cooling: -
- Thermal Resistance: -
- Wick Type: -
- Length: 4.606" (117.00mm)
- Width: 3.543" (90.00mm)
- Height: 1.087" (27.60mm)
- Diameter: -
- Operating Temperature: -
- Features: -
- Material: Copper
- Platform: -