XCZU1EG-2SFVA625E
AMD Xilinx
Product details
Engineered for next-generation automotive electronics, AMD Xilinx's XCZU1EG-2SFVA625E redefines Embedded - System On Chip (SoC) performance in vehicular applications. This advanced SoC combines automotive-grade reliability with sophisticated power management, making XCZU1EG-2SFVA625E the ideal choice for ADAS systems where signal integrity and functional safety are paramount.The dual-core MPU, FPGA architecture provides redundant processing paths that meet ASIL-D requirements for autonomous driving subsystems.Featuring the Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, the device delivers the computational density needed for real-time sensor fusion while meeting stringent automotive power budgets.With 256KB of error-protected RAM, the processor maintains data coherence during sudden power fluctuations common in automotive environments.Automotive-specific DMA, WDT include CAN-FD controllers and automotive Ethernet MACs, reducing the need for external interface chips.Operating at 533MHz, 600MHz, 1.333GHz, the processor meets the real-time processing requirements of high-resolution radar and lidar systems.Qualified for 0°C ~ 100°C (TJ), the component maintains precise timing references across the full automotive temperature range.The 625-BFBGA, FCBGA package features automotive-grade materials that withstand thermal shock and mechanical vibration.Available in 625-FCBGA (21x21), the device meets AEC-Q100 Grade 1 requirements for automotive electronics.
Product Attributes
- Product Status: Active
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: -
- Speed: 533MHz, 600MHz, 1.333GHz
- Primary Attributes: -
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 625-BFBGA, FCBGA
- Supplier Device Package: 625-FCBGA (21x21)