XCZU4CG-L1FBVB900I
AMD Xilinx
XCZU4CG-L1FBVB900I
AMD Xilinx
IC SOC CORTEX-A53 900FCBGA
Reference Price (USD)
1+
$1686.33000
500+
$1669.4667
1000+
$1652.6034
1500+
$1635.7401
2000+
$1618.8768
2500+
$1602.0135
Exquisite packaging
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XCZU4CG-L1FBVB900I
$1,686.33
Product details
AMD Xilinx's XCZU4CG-L1FBVB900I sets new standards in Embedded - System On Chip (SoC) technology, optimized for industrial automation systems demanding uncompromising reliability. This SoC combines robust electromagnetic compatibility with precise voltage regulation, delivering exceptional performance in harsh manufacturing environments where XCZU4CG-L1FBVB900I excels in noise immunity and long-term stability.The innovative MCU, FPGA architecture incorporates redundant processing elements that provide fault-tolerant operation crucial for safety-critical applications.Powered by the Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, the device achieves industry-leading deterministic response times while maintaining ultra-low power consumption during idle states.With 256KB of error-correcting RAM, the processor ensures data integrity in high-vibration environments typical of factory automation equipment.The rich set of DMA, WDT enables direct sensor interfacing without additional signal conditioning circuits, simplifying system design while improving measurement accuracy.Advanced CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG options facilitate seamless integration with industrial fieldbus networks and legacy control systems alike.The 500MHz, 1.2GHz operating frequency provides sufficient headroom for complex control algorithms while maintaining precise synchronization across distributed systems.Zynq®UltraScale+™ FPGA, 192K+ Logic Cells deliver hardware-based safety features including watchdog timers and memory protection units required for SIL-3 certified equipment.Designed for -40°C ~ 100°C (TJ) operation, the component withstands thermal cycling stresses encountered in outdoor industrial installations.The rugged 900-BBGA, FCBGA construction ensures mechanical stability in high-shock environments while maintaining excellent thermal conductivity.The 900-FCBGA (31x31) format enables cost-effective manufacturing while meeting stringent industrial certification requirements.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 500MHz, 1.2GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
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