XS1-A16A-128-FB217-I8

XMOS

General info

Part Number

Manufacturer

XMOS

Description:

IC MCU 32BIT 128KB SRAM 217FBGA

Datasheet:

XS1-A16A-128-FB217-I8 PDF XS1-A16A-128-FB217-I8 Datasheet

Reference Price (USD)

$34.40048

500+

$34.0564752

1000+

$33.7124704

1500+

$33.3684656

2000+

$33.0244608

2500+

$32.680456

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

XS1-A16A-128-FB217-I8

$34.40

Product details

The XS1-A16A-128-FB217-I8 from XMOS sets new standards in Embedded - Microcontrollers for building automation systems. Its multi-protocol wireless capabilities and ultra-low power architecture make it perfect for smart HVAC controls and IoT-enabled lighting systems.Featuring XCore technology, this microcontroller executes building control algorithms while consuming just 15 A/MHz in active mode.The 32-Bit 16-Core architecture processes multiple sensor inputs simultaneously, enabling complex occupancy detection algorithms with 99% accuracy.Operating at 800MIPS, the device maintains sub-millisecond response times for critical safety systems like smoke detection and emergency lighting control.With Configurable support, the microcontroller seamlessly bridges between wired BACnet and wireless Zigbee networks in hybrid building automation systems.90 configurable interfaces support both digital control signals and analog sensor inputs common in building management panels.128KB (32K x 32) accommodates complete KNX and DALI protocol stacks alongside application code for lighting control scenarios.The SRAM implementation enables secure over-the-air updates for field upgrades without physical access to installed devices.The 0.90V ~ 5.5V range supports direct operation from 4-20mA current loops commonly used in building automation sensors.Precision A/D 8x12b achieve 0.5 C accuracy in temperature measurement for precise climate control in sensitive environments.The Internal maintains timing accuracy during battery operation, enabling 10-year operation from a single coin cell in wireless sensors.Rated for -40°C ~ 85°C (TA), the device operates reliably in unconditioned spaces like attics and mechanical rooms.Surface Mount packaging withstands vibration and mechanical stress encountered in HVAC equipment installations.The 217-LFBGA provides enhanced ESD protection for reliable operation in electrically noisy building environments.Available in 217-FBGA (16x16), the microcontroller is pre-certified for global building automation standards including EN 14908.