XUF232-512-FB374-I40A
XMOS
Product details
XMOS's XUF232-512-FB374-I40A sets new benchmarks in Embedded - Microcontrollers performance, optimized for next-generation automotive electronics. Its radiation-hardened design and exceptional EMI immunity make it the preferred choice for safety-critical vehicle control systems.The XCore core architecture incorporates dual instruction pipelines that deliver 1.5 DMIPS/MHz, significantly enhancing computational throughput for autonomous driving algorithms.A 32-Bit 32-Core processing width enables single-cycle execution of complex DSP operations, reducing latency in active noise cancellation systems for premium automotive audio.When clocked at 2000MIPs, the microcontroller achieves 32-bit floating point operations in just 3 cycles, enabling real-time processing of LiDAR point clouds for ADAS applications.With USB protocol support, the device forms the backbone of in-vehicle networks, providing deterministic communication between ECUs with <100ns synchronization accuracy.176 programmable interfaces support mixed-voltage operation from 1.8V to 5V, simplifying integration with legacy automotive sensors and actuators.2MB (2M x 8) of fault-tolerant storage accommodates ASIL-D compliant software architectures with dual-core lockstep implementation for functional safety.The FLASH implementation features ECC protection with single-bit correction capability, ensuring code integrity in high-vibration environments.512K x 8 of parity-protected memory prevents data corruption from alpha particle strikes, meeting ISO 26262 requirements for safety-critical storage.An automotive-grade 0.95V ~ 3.6V range maintains operation during load dump events up to 40V, protecting against voltage transients common in 12V vehicle systems.External clocking architecture maintains <50ppm frequency stability across the entire automotive temperature range, ensuring reliable CAN bus timing.Qualified for -40°C ~ 85°C (TA), the device operates reliably in dashboard locations where ambient temperatures can exceed 85 C during summer conditions.The Surface Mount option provides superior solder joint reliability for PCB assemblies subjected to thermal cycling in underhood locations.374-LFBGA packaging incorporates copper heat spreaders that reduce junction temperatures by 15 C compared to standard packages in confined spaces.Available in 374-FBGA (18x18), the microcontroller supports AEC-Q100 Grade 1 qualification for deployment in safety-relevant automotive systems.
Product Attributes
- Product Status: Active
- Core Processor: XCore
- Core Size: 32-Bit 32-Core
- Speed: 2000MIPs
- Connectivity: USB
- Peripherals: -
- Number of I/O: 176
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 374-LFBGA
- Supplier Device Package: 374-FBGA (18x18)