10AS016E3F27E2SG
Intel
10AS016E3F27E2SG
Intel
IC SOC CORTEX-A9 1.5GHZ 672FBGA
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$817.08000
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$808.9092
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$800.7384
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$792.5676
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$784.3968
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$776.226
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10AS016E3F27E2SG
$817.08
Product details
Engineered for next-generation automotive electronics, Intel's 10AS016E3F27E2SG redefines Embedded - System On Chip (SoC) performance in vehicular applications. This advanced SoC combines automotive-grade reliability with sophisticated power management, making 10AS016E3F27E2SG the ideal choice for ADAS systems where signal integrity and functional safety are paramount.The dual-core MCU, FPGA architecture provides redundant processing paths that meet ASIL-D requirements for autonomous driving subsystems.Featuring the Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, the device delivers the computational density needed for real-time sensor fusion while meeting stringent automotive power budgets.With 256KB of error-protected RAM, the processor maintains data coherence during sudden power fluctuations common in automotive environments.Automotive-specific DMA, POR, WDT include CAN-FD controllers and automotive Ethernet MACs, reducing the need for external interface chips.The comprehensive EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports in-vehicle network topologies while providing robust EMI performance essential for automotive applications.Operating at 1.5GHz, the processor meets the real-time processing requirements of high-resolution radar and lidar systems.FPGA - 160K Logic Elements include hardware security modules that provide cryptographic acceleration for secure vehicle-to-cloud communications.Qualified for 0°C ~ 100°C (TJ), the component maintains precise timing references across the full automotive temperature range.The 672-BBGA, FCBGA package features automotive-grade materials that withstand thermal shock and mechanical vibration.Available in 672-FBGA, FC (27x27), the device meets AEC-Q100 Grade 1 requirements for automotive electronics.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 160K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA, FC (27x27)
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