S32G274AABK0VUCT
NXP USA Inc.
Product details
NXP USA Inc.'s S32G274AABK0VUCT sets new benchmarks in the Embedded - Microprocessors market segment, optimized for compute-intensive embedded applications. This system-on-chip solution integrates advanced processing cores with sophisticated power management, delivering exceptional performance-per-watt characteristics for energy-conscious designs.The ARM® Cortex®-A53, ARM® Cortex®-M7 architecture provides deterministic execution of real-time tasks while maintaining low power consumption, making it particularly suitable for battery-powered edge computing devices.Architected with 4 Core, 64-Bit/3 Core, 32-Bit capability, the processor enables efficient task partitioning and memory bandwidth utilization in multi-threaded applications.With clock speeds up to 400MHz, 1GHz, the device meets the computational demands of advanced motor control algorithms and power conversion systems.Support for DDR3L SDRAM, LPDDR4 DRAM memory technologies allows designers to optimize system cost and performance for specific application requirements.MII, RGMII, RMII, SGMII connectivity options provide the necessary bandwidth for industrial communication protocols including EtherCAT and PROFINET.USB OTG (1) implementations adhere to the latest USB standards, ensuring backward compatibility while supporting high-speed data transfers.Qualified for -40°C ~ 105°C (TA) operation, the processor reliably functions in outdoor telecommunications equipment and base station applications.Comprehensive HSE-H protect against both physical and network-based attacks, crucial for financial terminals and secure access systems.The 525-FBGA, FCBGA package design incorporates advanced thermal management features for reliable operation in confined spaces.Offered in 525-FCPBGA (19x19), the device supports both conventional and advanced PCB assembly techniques.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
- Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
- Speed: 400MHz, 1GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: MII, RGMII, RMII, SGMII
- SATA: -
- USB: USB OTG (1)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: HSE-H
- Package / Case: 525-FBGA, FCBGA
- Supplier Device Package: 525-FCPBGA (19x19)