TDA4VM88TGBALFR
Texas Instruments
TDA4VM88TGBALFR
Texas Instruments
NEXT GENERATION SOC FAMILY FOR L
Reference Price (USD)
1+
$118.00000
500+
$116.82
1000+
$115.64
1500+
$114.46
2000+
$113.28
2500+
$112.1
Exquisite packaging
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TDA4VM88TGBALFR
$118.00
Product details
Texas Instruments's TDA4VM88TGBALFR sets new standards in Embedded - System On Chip (SoC) technology, optimized for industrial automation systems demanding uncompromising reliability. This SoC combines robust electromagnetic compatibility with precise voltage regulation, delivering exceptional performance in harsh manufacturing environments where TDA4VM88TGBALFR excels in noise immunity and long-term stability.The innovative DSP, MCU, MPU architecture incorporates redundant processing elements that provide fault-tolerant operation crucial for safety-critical applications.Powered by the ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x, the device achieves industry-leading deterministic response times while maintaining ultra-low power consumption during idle states.With 1.5MB of error-correcting RAM, the processor ensures data integrity in high-vibration environments typical of factory automation equipment.The rich set of DMA, PWM, WDT enables direct sensor interfacing without additional signal conditioning circuits, simplifying system design while improving measurement accuracy.Advanced MCAN, MMC/SDSD/IOI²C, SPI, UART, USB options facilitate seamless integration with industrial fieldbus networks and legacy control systems alike.The 2GHz, 1GHz, 1.35GHz, 1GHz operating frequency provides sufficient headroom for complex control algorithms while maintaining precise synchronization across distributed systems.Designed for -40°C ~ 105°C (TJ) operation, the component withstands thermal cycling stresses encountered in outdoor industrial installations.The rugged 827-BFBGA, FCBGA construction ensures mechanical stability in high-shock environments while maintaining excellent thermal conductivity.The 827-FCBGA (24x24) format enables cost-effective manufacturing while meeting stringent industrial certification requirements.
Product Attributes
- Product Status: Active
- Architecture: DSP, MCU, MPU
- Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
- Flash Size: -
- RAM Size: 1.5MB
- Peripherals: DMA, PWM, WDT
- Connectivity: MCAN, MMC/SDSD/IOI²C, SPI, UART, USB
- Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
- Primary Attributes: -
- Operating Temperature: -40°C ~ 105°C (TJ)
- Package / Case: 827-BFBGA, FCBGA
- Supplier Device Package: 827-FCBGA (24x24)
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