PLCHIP-P10-51220X10
Divelbiss Corporation
Product details
The PLCHIP-P10-51220X10 from Divelbiss Corporation represents a cutting-edge solution in Embedded - System On Chip (SoC), engineered for high-performance embedded systems requiring precise signal processing. This SoC integrates advanced clock generation capabilities with robust thermal management, making it ideal for 5G infrastructure applications where signal integrity and low-latency operation are critical.Featuring an MCU architecture, this component delivers exceptional processing efficiency while maintaining deterministic timing characteristics essential for real-time systems.With its PLC core, the device achieves optimal balance between computational throughput and power efficiency, enabling complex algorithm execution in power-constrained environments.The substantial 256KB flash memory accommodates extensive firmware libraries and real-time operating systems, providing developers with ample space for feature-rich applications.32KB of high-speed RAM ensures smooth multitasking performance, particularly beneficial for applications requiring rapid context switching and data buffering.Integrated peripherals including LCD, PWM, WDT offer designers unparalleled flexibility in system configuration, reducing BOM costs while enhancing I/O capabilities.Comprehensive CANbus, Ethernet, I²C, MMC/SD, SPI, UART/USART interfaces support seamless integration into heterogeneous networks, addressing the growing demand for interconnected industrial IoT solutions.Operating at 12MHz, the processor maintains exceptional timing precision critical for phase-sensitive applications like motor control and RF modulation.Rated for -40°C ~ 85°C (TJ), this component maintains stable clock synchronization even in thermally challenging environments such as automotive engine compartments.The compact 144-LQFP footprint enables high-density PCB layouts without compromising thermal dissipation or EMI performance.Available in 144-LQFP (20x20), the device supports automated pick-and-place assembly processes while ensuring reliable solder joint integrity.
Product Attributes
- Product Status: Active
- Architecture: MCU
- Core Processor: PLC
- Flash Size: 256KB
- RAM Size: 32KB
- Peripherals: LCD, PWM, WDT
- Connectivity: CANbus, Ethernet, I²C, MMC/SD, SPI, UART/USART
- Speed: 12MHz
- Primary Attributes: -
- Operating Temperature: -40°C ~ 85°C (TJ)
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)